Graduate Certificate in Semiconductor Device Failure Analysis
-- viewing now**Semiconductor Device Failure Analysis** is a specialized field that focuses on identifying and understanding the root causes of device failures in the semiconductor industry. This field is crucial for manufacturers, researchers, and quality assurance professionals who need to ensure the reliability and performance of electronic devices.
2,426+
Students enrolled
GBP £ 149
GBP £ 215
Save 44% with our special offer
About this course
By studying semiconductor device failure analysis, learners gain a deep understanding of the complex interactions between device materials, manufacturing processes, and environmental factors that contribute to device failures.
**Some key areas of focus** include failure modes and effects analysis, reliability testing, and statistical process control. This knowledge enables learners to develop effective strategies for preventing device failures and improving overall product quality.
Whether you're a seasoned engineer or just starting your career, a Graduate Certificate in **Semiconductor Device Failure Analysis** can help you stay ahead of the curve in this rapidly evolving field.
So why wait? Explore this exciting field further and discover the many opportunities it has to offer.
100% online
Learn from anywhere
Shareable certificate
Add to your LinkedIn profile
2 months to complete
at 2-3 hours a week
Start anytime
No waiting period
Course details
•
Failure Analysis Techniques: This unit covers various methods used to analyze failed semiconductor devices, including optical microscopy, scanning electron microscopy, and failure mode and effects analysis (FMEA). •
Device Physics and Reliability: This unit explores the fundamental principles of semiconductor device physics and reliability, including device modeling, reliability modeling, and failure mechanisms. •
Microelectronic Packaging and Interconnects: This unit focuses on the design, fabrication, and testing of microelectronic packaging and interconnects, including flip-chip bonding, wire bonding, and 3D stacked integration. •
Failure Analysis of Memory Devices: This unit specifically addresses the failure analysis of memory devices, including DRAM, flash memory, and other types of non-volatile memory. •
Reliability and Failure Prediction: This unit covers the principles of reliability engineering, including reliability modeling, failure prediction, and statistical process control. •
Advanced Failure Analysis Tools and Techniques: This unit introduces advanced failure analysis tools and techniques, including electron beam induced current (EBIC) analysis, scanning tunneling microscopy (STM), and atomic force microscopy (AFM). •
Failure Analysis of Power Electronic Devices: This unit focuses on the failure analysis of power electronic devices, including power MOSFETs, IGBTs, and thyristors. •
Materials Science and Failure Analysis: This unit explores the relationship between materials science and failure analysis, including the properties of semiconductor materials, defects, and failure mechanisms. •
Statistical Process Control and Reliability Engineering: This unit covers the principles of statistical process control and reliability engineering, including design of experiments, statistical process monitoring, and reliability modeling. •
Emerging Trends in Failure Analysis: This unit introduces emerging trends in failure analysis, including the impact of nanotechnology, 3D integration, and the Internet of Things (IoT) on semiconductor device failure analysis.
Failure Analysis Techniques: This unit covers various methods used to analyze failed semiconductor devices, including optical microscopy, scanning electron microscopy, and failure mode and effects analysis (FMEA). •
Device Physics and Reliability: This unit explores the fundamental principles of semiconductor device physics and reliability, including device modeling, reliability modeling, and failure mechanisms. •
Microelectronic Packaging and Interconnects: This unit focuses on the design, fabrication, and testing of microelectronic packaging and interconnects, including flip-chip bonding, wire bonding, and 3D stacked integration. •
Failure Analysis of Memory Devices: This unit specifically addresses the failure analysis of memory devices, including DRAM, flash memory, and other types of non-volatile memory. •
Reliability and Failure Prediction: This unit covers the principles of reliability engineering, including reliability modeling, failure prediction, and statistical process control. •
Advanced Failure Analysis Tools and Techniques: This unit introduces advanced failure analysis tools and techniques, including electron beam induced current (EBIC) analysis, scanning tunneling microscopy (STM), and atomic force microscopy (AFM). •
Failure Analysis of Power Electronic Devices: This unit focuses on the failure analysis of power electronic devices, including power MOSFETs, IGBTs, and thyristors. •
Materials Science and Failure Analysis: This unit explores the relationship between materials science and failure analysis, including the properties of semiconductor materials, defects, and failure mechanisms. •
Statistical Process Control and Reliability Engineering: This unit covers the principles of statistical process control and reliability engineering, including design of experiments, statistical process monitoring, and reliability modeling. •
Emerging Trends in Failure Analysis: This unit introduces emerging trends in failure analysis, including the impact of nanotechnology, 3D integration, and the Internet of Things (IoT) on semiconductor device failure analysis.
Career path
**Career Roles in Semiconductor Device Failure Analysis**
- **Failure Analysis Engineer**: Conduct failure analysis on semiconductor devices to identify root causes and develop corrective actions.
- **Device Reliability Engineer**: Design and develop reliable semiconductor devices and systems, ensuring they meet performance and quality standards.
- **Quality Control Engineer**: Implement and maintain quality control processes to ensure semiconductor devices meet specifications and regulatory requirements.
- **Materials Scientist**: Research and develop new materials and technologies for semiconductor devices, improving their performance and reliability.
- **Electronics Engineer**: Design, develop, and test electronic circuits and systems, including semiconductor devices and systems.
Entry requirements
- Basic understanding of the subject matter
- Proficiency in English language
- Computer and internet access
- Basic computer skills
- Dedication to complete the course
No prior formal qualifications required. Course designed for accessibility.
Course status
This course provides practical knowledge and skills for professional development. It is:
- Not accredited by a recognized body
- Not regulated by an authorized institution
- Complementary to formal qualifications
You'll receive a certificate of completion upon successfully finishing the course.
Why people choose us for their career
Loading reviews...
Frequently Asked Questions
Debug: False
Course fee
MOST POPULAR
Fast Track
GBP £149
Complete in 1 month
Accelerated Learning Path
- 3-4 hours per week
- Early certificate delivery
- Open enrollment - start anytime
Standard Mode
GBP £99
Complete in 2 months
Flexible Learning Pace
- 2-3 hours per week
- Regular certificate delivery
- Open enrollment - start anytime
What's included in both plans:
- Full course access
- Digital certificate
- Course materials
All-Inclusive Pricing • No hidden fees or additional costs
Get course information
Earn a career certificate
GRADUATE CERTIFICATE IN SEMICONDUCTOR DEVICE FAILURE ANALYSIS
is awarded to
Learner Name
who has completed a programme at
London School of Planning and Management (LSPM)
Awarded on
05 May 2025
Blockchain Id: s-1-a-2-m-3-p-4-l-5-e
Add this credential to your LinkedIn profile, resume, or CV. Share it on social media and in your performance review.
